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This is what we stand for
We offer laser dicing and grooving systems, that enable the lowest cost of ownership through the shortest process time and high flexibility. This ensures that ASMPT’s laser systems are ideally suited for your application.
We develop laser dicing and grooving solutions that enable semiconductor manufacturers to reduce the product manufacturing cost through yield improvement, higher productivity, increased number of dies per wafer. our expertise is in RFIC, LED, IC, Low-K and Discrete.
To enable the low cost of ownership all modules within the system support and contribute to achieve this proposition. To keep up with the demanding semiconductor market, continuous technology development enables; smaller, better and more cost effective products for wafer dicing and grooving applications.
ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
ALSI originated from the semiconductor industry and has a clear understanding of how to meet the driving forces in this industry. ALSI was founded in the year 2001 as a spin off from Philips Semiconductors and started with a transfer of knowhow and patents from Royal Philips NV, through which ALSI has obtained the unique Intellectual Property Rights on multiple beam laser separation technology.
The Philips laser dicing technology was proven by the billions of separated units, and ALSI continued the development of this proprietary technology and introduced it to the whole semiconductor industry. Meanwhile ALSI’s technologies have lead to a breakthrough in the LED and RF-IC industry; wafers of High Brightness LED’s and GaAs RF-IC’s for mobile communication are increasingly diced by ALSI’s Multiple Laser Beam Process, in which ALSI has achieved a leading position. ASM Laser Separation International (ALSI) is a wholly owned subsidiary of ASM Pacific Technology Ltd (ASM PT), which is listed on the Hong Kong Stock Exchange and is the world’s largest assembly and packaging equipment supplier.
ALSI will serve as the Group’s Advanced Laser Technology Centre to develop new processes and supply systems for laser dicing and grooving applications in the semiconductor industry.
2001- Philips Spin-off, Patented Beam Splitting Technology
2003- Manufacturing Partnership with VDL/ETG (ASML, NXP, Applied Materials, etc.)
2003- First shipment of 150 mm Platform (enabling Bonded LED applications)
2005- First shipment of 200 mm (enabling RFIC Applications)
2005- Patented Etch Post process for RFIC applications
2007- RFIC- GaAs Wafer Dicing Market Leader
2010- First shipment of 300 mm (Grooving) based on Multiple Beam Technology
2012- Introduction of Kerf check On the Fly Technology (patented)
2013- Qualification at major Japanese customer (T&D) and several Taiwan OSAT’s (Grooving)
2013- Introduction of Spot to lane check (S2L) Technology (patented)
2014- Acquired by ASM Pacific Technology 2014- Introduction Matrix Grooving Technology (patented)
About our applications
The vast majority of RFIC devices used in cellular phones and wireless infrastructures are made of GaAs substrates. GaAs material is most competitive for high frequency, high speed and/or low power consumption for components such as power amplifiers and switches.
New applications such as sensors and many new developments with sensitive and complex structures, MEMS, do not allow dicing processes with high-pressure water cleaning nor any dust or particle distribution.
Dive into our technology
Compared to mechanical separation methods such as sawing or scribing and breaking laser dicing offers mainly three key advantages:
- A smaller separation width.
- A reduction of the throughput time.
- An increased yield.
- Unidirectional (sawing)
- Bi-directional (laser dicing)
The design of ASM ALSI machine platform has been made with productive and accurate laser dicing of semiconductor wafers in mind. It incorporates over 12 years of experience in laser dicing of wafers originally at NXP (formerly Philips Semiconductor), and the extensive know-how available in the well-established semiconductor equipment manufacturers in The Netherlands and Germany.
ASMPT has developed a proprietary process with a unique V-DOE Multi beam process for dicing thin Si (<<100um) IC (low-K) wafers with low CoO and while achieving a high Die Strength (typically >500MPa).
This technology allows in a single process step to dice through the Low-K/metal/passivation top layers, Si substrate and DAF or FOW with a high quality and die strength without the need for additional process steps which is the case with other separation technologies such as DBG, SDBG, GAL or Plasma Read more…
Spot to lane (S2L)
Automatic S2L ensure that the first lane processed on the wafer to be in the correct position. While Kerf check on the fly monitors the performance while processing, S2L ensures also the first lane on the wafer to be in the correct position. Read more…
As metal layers are increasing in thickness a single pass single row pass is not sufficient to achieve the required grooving depth. Matrix grooving allows to utilize the available laser power and convert power into productivity increase while maintaining small HAZ. Read more…