EPTC 2016

Electronics Packaging Technology Conference 2016

Title:               New Laser Multi Beam Full Cut Dicing of wafer level chip-scale packages (Fan In)
Name:             Jeroen van Borkulo, Product Marketing Manager ASM ALSI
Date:               Friday 2 Dec 2016
Location:        Suntec Convention Centre Singapore
Room:             MR333,  Session F2
Time:               16:40 pm – 17:00 pm

ADVANCE PROGRAM

Conference date Wednesday 30th November 2016 till 3rd December 2016

General info