Micro-Electro-Mechanical-Systems (MEMS) pose two major issues for mechanical sawing, which still is the predominant separation technique nowadays.
Material combinations in the dicing street such as glass on silicon can only be diced with a low yield even at low feed rates. The achieved cut is characterized by chip-outs and delamination.
In many cases delicate surface structures must not be exposed to liquids which are needed for reducing the friction and purging particles. In such cases a debris free separation technique is needed.
Laser dicing offers a solution in both cases. Laser induced material removal introduces no primary mechanical forces. As a result chip outs and delamination can be kept to a minimum. Moreover the processing wavelength can be chosen to maximize absorption inside the target material in order to achieve a high productivity.
As debris free separation is essential a processing wavelength is selected which can be focused inside the material leading to a sub-surface modification which allows a controlled material separation as soon as the specimen is subjected to tensile stress. In this case no material is removed which allows to achieve a separation width of virtually zero.