ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity.
ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
By splitting up a single laser beam in numerous components – depending on the application, the number of beams can reach up to about 100 – the local energy input is limited provided sufficient spacing between adjacent spots is guaranteed.
Technical specialists are available for phone support and advice. All our machines are equipped with remote service facilities, which allows our specialists to login and have an in depth inspection right away, whenever support is requested In this way over 90% of the service call can be solved.
