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Multi-Beam

Laser Dicing & Grooving

About
About

ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity.

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LASER1205
LASER1205

ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.

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Contact
Contact

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Service & Support
Service & Support

Technical specialists are available for phone support and advice. All our machines are equipped with remote service facilities, which allows our specialists to login and have an in depth inspection right away, whenever support is requested In this way over 90% of the service call can be solved.

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  • Company
    • Core Strength
    • History
    • Center of Competency
      • Mechatronics Team
      • AI & Vision Team
  • Applications
    • Application examples
    • IC – Micro – Logic
    • IC – Memory
    • IC – Analog
    • Opto
    • Sensors
    • Power Discrete
  • Process
    • VI-Process
    • V-Process
    • Scribing
    • Multi-Beam
    • USP Matrix
    • UV Matrix
  • Products
    • Overview
    • Laser1205 Grooving UV USP
    • Laser1205 Grooving UV
    • Laser1205 Dicing UV +
    • Laser1205 Dicing IR
  • Technology
    • Kerf Check “On-The-Fly”
    • Inline Vision
    • Wavelength
    • Pulse Duration
    • Diffractive Optical Element (DOE)
    • Active Mounts
  • Support
    • Support activities
    • Application support
    • Global service support centres
    • Training
  • Contact
  • Careers
    • Jobs
    • Internships
  • Company
    • Core Strength
    • History
    • Center of Competency
      • Mechatronics Team
      • AI & Vision Team
  • Applications
    • Application examples
    • IC – Micro – Logic
    • IC – Memory
    • IC – Analog
    • Opto
    • Sensors
    • Power Discrete
  • Process
    • VI-Process
    • V-Process
    • Scribing
    • Multi-Beam
    • USP Matrix
    • UV Matrix
  • Products
    • Overview
    • Laser1205 Grooving UV USP
    • Laser1205 Grooving UV
    • Laser1205 Dicing UV +
    • Laser1205 Dicing IR
  • Technology
    • Kerf Check “On-The-Fly”
    • Inline Vision
    • Wavelength
    • Pulse Duration
    • Diffractive Optical Element (DOE)
    • Active Mounts
  • Support
    • Support activities
    • Application support
    • Global service support centres
    • Training
  • Contact
  • Careers
    • Jobs
    • Internships
  • Company
    • Core Strength
    • History
    • Center of Competency
      • Mechatronics Team
      • AI & Vision Team
  • Applications
    • Application examples
    • IC – Micro – Logic
    • IC – Memory
    • IC – Analog
    • Opto
    • Sensors
    • Power Discrete
  • Process
    • VI-Process
    • V-Process
    • Scribing
    • Multi-Beam
    • USP Matrix
    • UV Matrix
  • Products
    • Overview
    • Laser1205 Grooving UV USP
    • Laser1205 Grooving UV
    • Laser1205 Dicing UV +
    • Laser1205 Dicing IR
  • Technology
    • Kerf Check “On-The-Fly”
    • Inline Vision
    • Wavelength
    • Pulse Duration
    • Diffractive Optical Element (DOE)
    • Active Mounts
  • Support
    • Support activities
    • Application support
    • Global service support centres
    • Training
  • Contact
  • Careers
    • Jobs
    • Internships

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