Laser Dicing & Grooving
ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity.
ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
Technical specialists are available for phone support and advice. All our machines are equipped with remote service facilities, which allows our specialists to login and have an in depth inspection right away, whenever support is requested In this way over 90% of the service call can be solved.
