ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
With advanced technology, close customer collaboration and strong product creation, we are able to create highest customer value. ALSI is part of the global ASM Pacific Technology network organization and operates in the SEMI industry on a wafer level. We have worldwide application labs and satellite teams to support each customer in their own region. Please visit our product page for more information on our products and contact us at email@example.com