ASM Laser Separation International (ALSI) is the inventor of Multi-Beam laser dicing and grooving. The Multi-Beam laser dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ALSI’s solutions enables you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
With advanced technology, close customer collaboration and strong product creation, we are able to create high customer value. ALSI is part of the global ASM Pacific Technology network organization and operates in the SEMI industry on a wafer level. We have worldwide application labs and satellite teams to support each customer in their own region. Please visit our product page for an overview of the products we offer and contact us at email@example.com