History

ASM ALSI was founded in the year 2001 as a spin off from Philips Semiconductors and started with a transfer of knowledge and patents from Royal Philips NV, through which ASM ALSI has obtained the unique intellectual property rights of Multi Beam Laser Processing Technology.

The Philips laser dicing technology was proven by the billions of separated units, and ASM ALSI continued the development of this proprietary technology and introduced it to the whole semiconductor industry. This has made us market leader in processing wafers of High Brightness LED’s and GaAs RFIC’s for mobile communication for the LED and RFIC industry.

ASM ALSI is a wholly owned subsidiary of ASM Pacific Technology,  which is headquartered in Singapore and is listed on the Hong Kong Stock Exchange since 1989.  ASM Pacific Technology is the world’s largest assembly and packaging equipment supplier. ASM ALSI serves as the Group’s Advanced Laser Technology Centre to develop new processes and supply systems for laser dicing and grooving applications in the semiconductor industry.

Laser1205 Production transferred to ATS Singapore

2021

Multiple USP Machines shipped to Korea for HVM Manufacturing

2020

Qualified by leading Power Semiconductor company

2019

Number#1 Laser Grooving supplier to the DDI (Display Driver IC) Market

2018

Number#1 Laser Dicing supplier to the LED & VCSEL Market

2017

OSAT’s ASE, Amkor and Huatian switched to ASM Grooving systems

2016

Celebration of the 40th Anniversary of ASMPT

2015

Acquired by ASM Pacific Technology

2014

Introduction Matrix Grooving Technology (patented)

2014

Introduction of Spot to lane check (S2L) Technology (patented)

2013

Qualification at major Japanese customer (T&D) and several Taiwan OSAT’s (Grooving)

2013

Introduction of Kerf Check “On-the-Fly” (patented)

2012

First shipment of 300 mm (Grooving) based on Multi-Beam Technology

2010

RFIC- GaAs Wafer Dicing Market Leader

2007

Patented Etch Post process for RFIC applications

2005

First shipment of 200 mm (enabling RFIC Applications)

2005

First shipment of 150 mm Platform (enabling Bonded LED applications)

2003

Manufacturing Partnership with VDL/ETG (ASML, NXP, Applied Materials, etc.)

2003

Philips Spin-off, Patented Beam Splitting Technology

2001