ASM ALSI was founded in the year 2001 as a spin off from Philips Semiconductors and started with a transfer of knowledge and patents from Royal Philips NV, through which ASM ALSI has obtained the unique intellectual property rights of Multi Beam Laser Processing Technology.
The Philips laser dicing technology was proven by the billions of separated units, and ASM ALSI continued the development of this proprietary technology and introduced it to the whole semiconductor industry. This has made us market leader in processing wafers of High Brightness LED’s and GaAs RFIC’s for mobile communication for the LED and RFIC industry.
ASM ALSI is a wholly owned subsidiary of ASM Pacific Technology, which is headquartered in Singapore and is listed on the Hong Kong Stock Exchange since 1989. ASM Pacific Technology is the world’s largest assembly and packaging equipment supplier. ASM ALSI serves as the Group’s Advanced Laser Technology Centre to develop new processes and supply systems for laser dicing and grooving applications in the semiconductor industry.
Laser1205 Production transferred to ATS Singapore
2021
Multiple USP Machines shipped to Korea for HVM Manufacturing
2020
Qualified by leading Power Semiconductor company
2019
Number#1 Laser Grooving supplier to the DDI (Display Driver IC) Market
2018
Number#1 Laser Dicing supplier to the LED & VCSEL Market
2017
OSAT’s ASE, Amkor and Huatian switched to ASM Grooving systems
2016
Celebration of the 40th Anniversary of ASMPT
2015
Acquired by ASM Pacific Technology
2014
Introduction Matrix Grooving Technology (patented)
2014
Introduction of Spot to lane check (S2L) Technology (patented)
2013
Qualification at major Japanese customer (T&D) and several Taiwan OSAT’s (Grooving)
2013
Introduction of Kerf Check “On-the-Fly” (patented)
2012
First shipment of 300 mm (Grooving) based on Multi-Beam Technology
2010
RFIC- GaAs Wafer Dicing Market Leader
2007
Patented Etch Post process for RFIC applications
2005
First shipment of 200 mm (enabling RFIC Applications)
2005
First shipment of 150 mm Platform (enabling Bonded LED applications)
2003
Manufacturing Partnership with VDL/ETG (ASML, NXP, Applied Materials, etc.)
2003
Philips Spin-off, Patented Beam Splitting Technology
2001