BAW-Filters: Silicon (100μm – 150μm)

• Diameter: 200 mm
• Wafer material: Si
• Thickness: 135 µm
• Die pitch: 1100 µm x 700 µm
• Street width: 60 µm

Results

• Process : Dicing-UV-ns # MB
• Kerf Width : 13 µm
• Dicing width: 35 µm
• Burr height: < 4 µm
• UPH : 3.3