Display Drivers: Si (780 µm)

Wafer

• Diameter: 300 mm
• Wafer material: Si
• Thickness: 780 µm
• Die pitch: 32800 µm x 1160 µm
• Street width: 80 µm

Results and benefits

• Modification width: 60 µm
• Outer width: 55 µm
• Inner width: 49 µm
• Groove depth: 5 ~ 7 µm
• Burr height: 1.5 µm max