Glass (50 – 100μm)

• Diameter: 150 mm
• Wafer material: Glass
• Thickness: 100 µm
• Die pitch: 7500 µm x 7500 µm
• Street width: NA

Results

• Process : Dicing-UV-ns # MB
• Kerf width: 14 µm
• Dicing width: 180 µm
• Burr height: NA
• UPH : NA