Indium phosphide (InP 50µm – 100 µm)

• Diameter: 100 mm
• Wafer material: InP
• Thickness: 100 µm
• Die pitch: 250 µm x 250 µm
• Street width: 10 x 40 µm

Results

• Kerf width: 6 µm
• Dicing width : < 14 µm
• Burr height : < 8 µm
• UPH : 5.5