LED (bonded): AISi (150 – 200μm)

• Diameter: 150 mm
• Wafer material: AlSi
• Thickness: 200 µm
• Die pitch: 360 µm x 360 µm
• Street width: 30 µm

Results

• Dicing-UV-ns # MB
• Kerf Width : 8 – 10 µm
• Burr height: 10 µm
• UPH : 0.9