LiTaO3

  • Diameter: 150 mm
  • Wafer material: LiTaO3
  • Thickness: 220 µm
  • Die pitch: 1550 µm x 1150 µm
  • Street width: 100 µm

Results

  • Dicing width: < 20 µm (scribe depth 40 µm)
  • Burr height:  NA
  • UPH :  NA