Logic: Si (280µm)

Wafer

• Diameter: 300 mm
• Wafer material: Si
• Thickness: 780 µm
• Die pitch: 4470 µm x 4950 µm
• Street width: 65 µm

Results and benefits

• Modification width: 50 µm
• Outer width: 45 µm
• Inner width: 30 µm
• Groove depth: 11.5 µm
• Burr height: <4 µm max