Printed Circuit Board (PCB)

• Diameter: 200 mm
• Wafer material: Substrate
• Thickness: 0.25 mm
• Die pitch: 3mm x 4mm
• Street width: 465 µm

Results

• Process : Dicing-UV-ns # T + MB
• Dicing width: 50 µm
• Burr height: <11 µm
• UPH :  1.0