Printed Circuit Board (PCB)

  • Diameter: 200 mm
  • Wafer material: Substrate
  • Thickness: 0.25 mm
  • Die pitch: 3mm x 4mm
  • Street width: 465 µm

Results

  • Process : Dicing-UV-ns # T + MB
  • Dicing width: 50 µm
  • Burr height: <11 µm
  • UPH :  1.0