Sapphire (150 – 200µm)

• Diameter: 150 mm
• Wafer material: Sapphire
• Thickness: 200 µm
• Die pitch: 412 µm x 1062 µm
• Street width: 72 µm

Results

• Kerf width: 9 µm
• Dicing width : 22 µm
• UPH : 0.4