Sapphire (50 – 100μm)

• Diameter: 150 mm
• Wafer material: Sapphire
• Thickness: 60 µm
• Die pitch: 2220 µm x 4790 µm
• Street width: 100 µm

Results

• Kerf width: 5 µm
• Dicing width : < 15 µm
• Burr height : < 5 µm