Sapphire Scribing

• Diameter: 100 mm
• Wafer material: Sapphire
• Thickness: 130 µm
• Die pitch: 218 µm x 218 µm
• Street width: blank

Results

• Kerf width: 4 µm
• Scribing depth: 15 µm
• Scribing width: 10 µm
• Productivity:  > 12 wafers per hour