Silicon (150μm – 200μm)

• Diameter: 200 mm
• Wafer material: Si
• Thickness: 70 µm Si + 20 µm air + 110 µm Si
• Die pitch: 630 µm x 675 µm
• Street width: 65 µm

Results

• Process : Dicing-UV-ns # MB
• Kerf Width : 9 µm
• Dicing width: 21 µm
• Burr height: < 10 µm
• UPH : 1.2