Silicon Carbide (150μm)

• Diameter: 150 mm
• Wafer material: SiC
• Thickness: 150 µm
• Die pitch: 2100 µm x 2400 µm
• Street width: 80 µm

Results

• Dicing width: ~33 µm
• Burr height: < 5 µm
• Productivity:  1.7 wafers per hour