Grooving > UV Matrix

Features

  • Grooving UV Matrix is used when wafers are mostly thicker then 200um.
    For these thicknesses it is financially more attractive to open/remove the active top layer by grooving and continue the remaining thickness by blade saw.
  • ASMPT developed a technology which derives also from the Multi-Beam concept and is called Matrix Grooving.
  • The Matrix Grooving Process flow is first a trenching step, followed by a first row in the matrix design. This Matrix Grooving will remove the material between the two trenches. As the stack of materials is increasing (15 – 20 um) many passes with a single row would be needed to achieve the required depth. Due to the multi beam concept we can create a matrix design with several rows behind each other and thus lowering the amount of passes needed.
  • The Matrix Grooving Process allows to achieve the required depth in a single pass. Similar as used in Multi-Beam dicing each beam in the matrix is low in power and all are working together to remove all the material without affecting or increasing the HAZ.
  • The Matrix Grooving Process is a patented process.

Advantages of our Matrix DOE.

For certain semiconductor applications it is not possible or economically viable to use a laser process to dice through a wafer. This is typically the case when the wafer or substrate is too thick (typically >200um). For these type of wafer thicknesses typically a saw blade dicing process is used. The problem when using a saw blade is that the wafers can have top layers which are sensitive to delamination and or cracking (e.g. SiO, Low-K or metals). For wafer technologies which use these type of top layer materials it is required to remove them prior to applying the saw blade process. In this case a laser can be used to remove these top layers. ASMPT developed a technology which derives also from the Multi-Beam concept. For this application we split the laser beam into a matrix configuration (see picture). In this process flow first a trenching step is applied. The first row in the matrix design will remove the material between the two trenches. As the stack of materials increases (15 – 20 um) many passes with a single row would be needed to achieve the required depth. Due to the Multi-Beam concept we can create a matrix design with several rows behind each other. The matrix process allows to achieve the required depth in a single pass. Similar as used in Multi-Beam dicing each beam in the matrix is low in power and all are working together to remove all the material without affecting or increasing the HAZ.