Grooving-UV-USP

ASMPT is permanently innovating to improve the value for its customers.
Ultra Short Pulse (USP) processing is next step in grooving technology due to its ‘cold’ nature which translates to close to no burr and a smooth groove profile.
By optimizing the Multi beam matrix concept we enable the utilization of all power available in today’s high power Ultra Short Pulse (USP) laser sources while maintaining the quality improvements. As a result, higher kerf quality at a productivity comparable with our standard Grooving machines.

The technology used enables large variety of grooving widths. Ranging from 10µm up to 150µm or more due to wide selection of multi beam matrix configurations.

Introduction of the system is scheduled for Q1 2022

Key Features:

    • Low burr (<1µm); smooth groove profile (<1µm)
    • Large variety of grooving widths. Ranging from 10µm up to 150µm
    • Extremely high position and grooving accuracy and repro (< ± 1.5µm)
    • High UPH due to system concept design focused on laser material processing:
      • Ultra short index time
      • Kerf check on the fly
      • Dual cassette load stations
      • Dual coat and clean stations

Typical values

Burr<1µm
Grooving profileU-shape
Adjustable Grooving width10...150µm
Pulse Widthps/fs

Features & Benefits

Best of class Process Quality
  • Process for HP UV-USP wavelength 335µm; pulse length 0.5 .. 10 ps
  • Production example Burr < 1um
  • Depth (w/wo metal) < 1um
  • Die strength >800MP
  • Process control In-line vision and process parameter logging
Production Scalability
  • Full automated calibrations D-DOE set <1µm; power level <..%
  • Flexibility up to 8 DOE’s recipe selectable
  • Proven platform concept for last 10 years
Compliant with Production Chain
  • Wafer handling capable of handling wafer thickness down to 80 µm grooved wafers
Competitive CoO
  • Production speed UPH same or better than G-UV processes