The system is designed to laser process the wafer at pre-defined positions at a very high level of accuracy. In practice the actual position can deviate from the pre-defined position due to earlier processes (like saw-blade cutting) or due to the laser process itself (like foil stretching or temperature effects).
Kerf Check On-the-fly is an in-line process control that monitors deviations of the actual position from the predefined position.
- Accurate wafer position measurement during processing
- Optional automatic correction of wafer position during processing
- Accurate kerf width variation measurement during processing
- No throughput penalty
- “On-the-Fly” monitoring and control