Please visit ASM Technical Seminar on Wednesday 22nd April at Equatorial Conference Room, Penang.
ASM Technical Seminar
Date: Wednesday 22nd April 2015
Venue: Ballroom 1 & 2, Hotel Equatorial Penang Malaysia
Time: 9:00 – 13:00hrs
Semiconductor Opportunities and Solutions For The IoTs:
| Time | Topics | Speakers | ||
| From | To | Duration (minutes) | ||
| 8:00 | 9:00 | 60 | Breakfast / Registration | |
| 9:00 | 9:40 | 40 | Packaging Trends in IoTs and Wearables: 3D CIS/IC and MEMS/IC Integrations | Dr. John Lau, Senior Technical Advisor |
| 9:40 | 10:00 | 20 | Enabling Technology and Process Development for Fine Pitch Flip Chip Interconnects | Nelson Fan, Business Development Director |
| 10:00 | 10:15 | 15 | Q&A | |
| 10:15 | 10:35 | 20 | Maximizing Throughput: Ultra High Speed & Precision in Small Die Bonding | Leung ChiKeung, Kurtis, Technical Manager, Product Dev – LED (FrontEnd) |
| 10:35 | 10:55 | 20 | MEMS and Sensor encapsulation for IOT | Lin Yi, Technical Manager in ESG Engineering |
| 10:55 | 11:15 | 20 | Faster, Better, Smarter: Final Testing in 0402 and beyond (FT Mini & Wafer Level Testing) | Cheung Cho Tao, Back End IC Product Marketing Mgr |
| 11:15 | 11:45 | 30 | Q&A/Tea Break | |
| 11:45 | 12:05 | 20 | Multi Beam grooving for Low-K semiconductors | Peter Dijkstra, Director of Asia Sales, ASM ALSI |
| 12:05 | 12:25 | 20 | New Generation Wire bonding Solution for IoT Packaging Challenges | Dominik Stephan, Technical Marketing Manager |
| 12:25 | 12:45 | 20 | Printing, SMT & SiP: Emerging trends in the world of miniaturization | Hong Kim Lee, Solutions Engineering Manager |
| 12:45 | 13:00 | 15 | Q&A | |
| 13:00 | 14:00 | 60 | Buffet Lunch | |
For more info contact: carlos@asmpt.com