ASM Technical Seminar

Please visit ASM Technical Seminar on Wednesday 22nd April at Equatorial Conference Room, Penang.

ASM Technical Seminar

Date:  Wednesday 22nd April 2015

Venue: Ballroom 1 & 2, Hotel Equatorial Penang Malaysia

Time: 9:00 – 13:00hrs

Semiconductor Opportunities and Solutions For The IoTs:

 

Time   Topics Speakers
From To Duration (minutes)
8:00 9:00 60 Breakfast / Registration
9:00 9:40 40 Packaging Trends in IoTs and Wearables: 3D CIS/IC and MEMS/IC Integrations Dr. John Lau, Senior Technical Advisor
9:40 10:00 20 Enabling Technology and Process Development for Fine Pitch Flip Chip Interconnects Nelson Fan, Business Development Director
10:00 10:15 15 Q&A
10:15 10:35 20 Maximizing Throughput: Ultra High Speed & Precision in Small Die Bonding Leung ChiKeung, Kurtis, Technical Manager, Product Dev – LED (FrontEnd)
10:35 10:55 20 MEMS and Sensor encapsulation for IOT Lin Yi, Technical Manager in ESG Engineering
10:55 11:15 20 Faster, Better, Smarter: Final Testing in 0402 and beyond (FT Mini & Wafer Level Testing) Cheung Cho Tao, Back End IC Product Marketing Mgr
11:15 11:45 30 Q&A/Tea Break
11:45 12:05 20 Multi Beam grooving for Low-K semiconductors Peter Dijkstra, Director of Asia Sales, ASM ALSI
12:05 12:25 20 New Generation Wire bonding Solution for IoT Packaging Challenges Dominik Stephan, Technical Marketing Manager
12:25 12:45 20 Printing, SMT & SiP: Emerging trends in the world of miniaturization Hong Kim Lee, Solutions  Engineering Manager
12:45 13:00 15 Q&A  
13:00 14:00 60 Buffet Lunch

 

For more info contact: carlos@asmpt.com