ECTC 2017

ECTC is the Electronic Components and Technology Conference @30 May- 2 June 2017

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.














Date: 31st May 2017 @ 1:55 PM – Laser Multi Beam Full Cut Dicing of Wafer Level Chip-Scale Packages

Jeroen van Borkulo, Eric Tan, and Richard van der Stam – ASM Pacific Technologies

Location: Walt Disney World Swan and Dolphin Resort
Lake Buena Vista, Florida USA
May 30 – June 2, 2017