Electronics Packaging Technology Conference 2016
Title: New Laser Multi Beam Full Cut Dicing of wafer level chip-scale packages (Fan In)
Name: Jeroen van Borkulo, Product Marketing Manager ASM ALSI
Date: Friday 2 Dec 2016
Location: Suntec Convention Centre Singapore
Room: MR333, Session F2
Time: 16:40 pm – 17:00 pm
https://eptc-ieee.net/2016/10/23/advance-program/
Conference date Wednesday 30th November 2016 till 3rd December 2016