MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 17,18, 2017
ASMPT will be presenting:
Session F: Advanced Singulation
Title : V-DOE Laser Full Cut Dicing of Thin Si IC Wafer
Speaker: J. Van Borkulo, ASMPT
Date: Wednesday 17th May, 2017
Time: 15h30 – 15h55
Location: WTC Grenoble, France