MiNaPAD 2017

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 17,18, 2017

ASMPT will be presenting:

Session F:   Advanced Singulation
Title :           V-DOE Laser Full Cut Dicing of Thin Si IC Wafer
Speaker:     J. Van Borkulo, ASMPT
Date:           Wednesday 17th May, 2017
Time:          15h30 – 15h55
Location:   WTC Grenoble, France

Progam MiNapad 2017