Hong Kong and Singapore, 5 April 2016
Author: Asm
Wafer Level / Panel Level Packaging Capabilities
Launch of three new systems — NUCLEUS, ORCAS and SUNBIRD — to support wafer level / panel level packaging market
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ASMPT Investment in Molded Interconnect Substrates (‘MIS’)
ASMPT and SPIL announce Joint Investment Venture in Molded Interconnect Substrates Continue reading “ASMPT Investment in Molded Interconnect Substrates (‘MIS’)”
Largest Microelectronics Event in Korea
SEMICON Korea; 27 – 29 January 2016
Semicon Taiwan
SEMICON Taiwan 2015 Post Show Report: Continue reading “Semicon Taiwan”
ASMPT ranked as Top 1 Assembly Equipment supplier
ASMPT is ranked as the No 1 Top Assembly Equipment Supplier in 2014
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Semicon West 2015
Today last day at Semicon West, Moscone Center, San Francisco
Strong Start to 2015
ASMPT 2015 First Quarterly Net Profit Surges 81.6% to HK$284.6 Million
MiniPAD Grenoble
MiNaPAD forum will be held at the WTC (World Trade Center) Grenoble, April 22 23, 2015
ASM Technical Seminar
Please visit ASM Technical Seminar on Wednesday 22nd April at Equatorial Conference Room, Penang.