Electronics Packaging Technology Conference 2016
Category: News & Events
Semicon Taiwan 2016 Forum
Please review pictues of the succesful Semicon Taiwan 2016 Continue reading “Semicon Taiwan 2016 Forum”
Semicon West 2016
Moscone Centre, San Francisco July 12 – 14, 2016
ASMPT ranked in Top 5
ASMPT Ranked Among Top 5 in VLSI Customer Satisfaction Survey 2016
ASMPT Supplier Excellence Award 2015
Hong Kong, Singapore, 1 April 2016
ASMPT Recognised For Excellence
Hong Kong and Singapore, 5 April 2016
Wafer Level / Panel Level Packaging Capabilities
Launch of three new systems — NUCLEUS, ORCAS and SUNBIRD — to support wafer level / panel level packaging market
Continue reading “Wafer Level / Panel Level Packaging Capabilities”
ASMPT Investment in Molded Interconnect Substrates (‘MIS’)
ASMPT and SPIL announce Joint Investment Venture in Molded Interconnect Substrates Continue reading “ASMPT Investment in Molded Interconnect Substrates (‘MIS’)”
Largest Microelectronics Event in Korea
SEMICON Korea; 27 – 29 January 2016
Semicon Japan 2015
Come and visit ASM Pacific Technology @ Semicon Japan 16- 18 Dec, 2015 (Tokyo)